Tiny USB OEM Module Provides 16 TTL/LVTTL Digital I/O and 8 Relay Outputs
The USBP-DIO16RO8 is an ideal OEM USB solution for adding embedded, easy-to-install buffered TTL/LVTTL digital I/O and relay output capabilities to any computer with a USB port. The USBP-DIO16RO8 is a USB 2.0 (1.1 compatible) high-speed device, offering the highest speed available with the USB Bus. The unit is hot pluggable allowing quick connect or disconnect whenever you need additional I/O in your system.
The unit can be installed in single or multiple stack configurations. It can also be mounted alone near I/O sensors or devices to be controlled in a star configuration away from the USB ports of its host embedded computer. The module is always connected by USB cable to any computer USB port via its external micro B connector or on-board friction-lock micro-fit connector.
Featuring 8 Form C (SPDT) electro-mechanical relays and 16 TTL/LVTTL buffered digital I/O lines, the unit is the smallest of its kind for digital monitoring and control using USB. This mix of programmable inputs and outputs together with the dedicated relays allows system designers greater flexibility while containing overall costs. The digital I/O lines have 32mA of both sink and source to drive external components and are available via a 34-pin IDC type vertical header. The pinout allows a simple accessory cable to interface to our 50-pin external signal conditioning products. The board can be switched from 5V to 3.3V signaling to match a particular device connected. The 8 relay outputs are de-energized at power-up to prevent an unintended control output signal. Data to the relays is latched. The relay contacts are available via a 26-pin IDC vertical header-keyed box type connector.
The USBP-DIO16RO8 draws all required power from the USB port, no external power adapter is required. The small size and easy connection makes the unit an excellent choice for a variety of embedded applicatiuons such as mobile, robotics, kiosks, and embedded medical and machine equipment.
The USBP-DIO16RO8 is designed to be used in rugged, industrial, and mobile environments and has the option to be upgraded to extended temperature specifications. The board is tiny Pico-I/O™ sized (60mm by 72mm) making it ideal for the smallest of embedded applications.
OEM USB/PICO FORM FACTOR
The tiny module occupies just half the area of a PC/104 board yet approaches the capability commonly found on the larger board standard. This board is perfect for deployment into space-limited applications and follows the ever-shrinking platform of the single board computer into the Pico-ITXe standard by VIA and other manufacturers.
The board is ideal for a variety of embedded applications. The USBP-DIO16RO8 can also be installed using standoffs inside a assortment of enclosures or systems. For embedded OEM type applications, an additional miniature USB input header is provided in parallel with the type B micro connector. What makes the USB/PICO form factor unique is that its PCB size and pre-drilled mounting holes match the Pico-I/O form factor (without the bus connections). This ensures easy installation using standard standoffs with any Pico-ITXe single board computer. The board can be added to any Pico-I/O stack by connecting it to a USB 2.0 port included on-board with the embedded CPU.
- Energy Management and Conservation
The USBP-DIO16RO8 is available with optional cable assemblies, screw terminal boards and external signal conditioning boards supporting high current relays, 120/240AC modules and optical isolated inputs.
The USBP-DIO16RO8 utilizes a high-speed custom function driver optimized for a maximum data throughput that is 50-100 times faster than the USB human interface device (HID) driver used by many competing products. This approach maximizes the full functionality of the hardware along with capitalizing the advantage of high-speed USB 2.0. The USBP-DIO16RO8 is supported for use in most operating systems and includes a free Linux (including Mac OS X) and Windows XP -> 10, both 32 & 64 bit compatible software package. This package contains sample programs and source code in Visual Basic, Delphi, and Visual C++ for Windows. Also incorporated is a graphical setup program in Windows. Third party support includes a Windows standard DLL interface usable from the most popular application programs and includes example LabVIEW VIs. Embedded OS support includes Windows Xpe, WES7, etc.